JPS59105018A - 封止用樹脂組成物 - Google Patents

封止用樹脂組成物

Info

Publication number
JPS59105018A
JPS59105018A JP21336282A JP21336282A JPS59105018A JP S59105018 A JPS59105018 A JP S59105018A JP 21336282 A JP21336282 A JP 21336282A JP 21336282 A JP21336282 A JP 21336282A JP S59105018 A JPS59105018 A JP S59105018A
Authority
JP
Japan
Prior art keywords
resin composition
resin
inorganic filler
epoxy resin
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21336282A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0249329B2 (en]
Inventor
Tsutomu Nagata
勉 永田
Tatsuo Sato
辰雄 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP21336282A priority Critical patent/JPS59105018A/ja
Publication of JPS59105018A publication Critical patent/JPS59105018A/ja
Publication of JPH0249329B2 publication Critical patent/JPH0249329B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
JP21336282A 1982-12-07 1982-12-07 封止用樹脂組成物 Granted JPS59105018A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21336282A JPS59105018A (ja) 1982-12-07 1982-12-07 封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21336282A JPS59105018A (ja) 1982-12-07 1982-12-07 封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS59105018A true JPS59105018A (ja) 1984-06-18
JPH0249329B2 JPH0249329B2 (en]) 1990-10-29

Family

ID=16637917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21336282A Granted JPS59105018A (ja) 1982-12-07 1982-12-07 封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS59105018A (en])

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07118504A (ja) * 1993-10-26 1995-05-09 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂成形材料
US6297332B1 (en) 1998-04-28 2001-10-02 Mitsui Chemicals, Inc. Epoxy-resin composition and use thereof
WO2010013406A1 (ja) * 2008-08-01 2010-02-04 住友ベークライト株式会社 半導体封止用樹脂組成物、およびこれを用いる半導体装置
JP2011084743A (ja) * 2000-02-15 2011-04-28 Hitachi Chem Co Ltd 接着剤組成物、その製造方法、これを用いた接着フィルム、半導体搭載用基板及び半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5236134B2 (ja) * 2001-01-26 2013-07-17 日立化成株式会社 接着剤組成物、接着部材、半導体搭載用支持部材及び半導体装置等

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53299A (en) * 1976-06-25 1978-01-05 Hitachi Ltd Epoxy resin composition
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53299A (en) * 1976-06-25 1978-01-05 Hitachi Ltd Epoxy resin composition
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07118504A (ja) * 1993-10-26 1995-05-09 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂成形材料
US6297332B1 (en) 1998-04-28 2001-10-02 Mitsui Chemicals, Inc. Epoxy-resin composition and use thereof
JP2011084743A (ja) * 2000-02-15 2011-04-28 Hitachi Chem Co Ltd 接着剤組成物、その製造方法、これを用いた接着フィルム、半導体搭載用基板及び半導体装置
WO2010013406A1 (ja) * 2008-08-01 2010-02-04 住友ベークライト株式会社 半導体封止用樹脂組成物、およびこれを用いる半導体装置
JPWO2010013406A1 (ja) * 2008-08-01 2012-01-05 住友ベークライト株式会社 半導体封止用樹脂組成物、およびこれを用いる半導体装置
US8552572B2 (en) 2008-08-01 2013-10-08 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor and semiconductor device using the same

Also Published As

Publication number Publication date
JPH0249329B2 (en]) 1990-10-29

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